Invention Application
- Patent Title: MINIATURIZED OPTICAL SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
-
Application No.: US17083763Application Date: 2020-10-29
-
Publication No.: US20220140173A1Publication Date: 2022-05-05
- Inventor: Chi-Chih SHEN , Kuo-Hsiung LI , Shang-Feng HSIEH , Jui-Cheng CHUANG , Yi-Chang CHANG
- Applicant: PixArt Imaging Inc.
- Applicant Address: TW Hsin-Chu County
- Assignee: PixArt Imaging Inc.
- Current Assignee: PixArt Imaging Inc.
- Current Assignee Address: TW Hsin-Chu County
- Main IPC: H01L31/14
- IPC: H01L31/14 ; H01L31/0203 ; H01L31/0232 ; H01L27/146

Abstract:
There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.
Public/Granted literature
- US11990557B2 Miniaturized optical sensor package and manufacturing method thereof Public/Granted day:2024-05-21
Information query
IPC分类: