Invention Application
- Patent Title: OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES
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Application No.: US17587664Application Date: 2022-01-28
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Publication No.: US20220157799A1Publication Date: 2022-05-19
- Inventor: Russell K. MORTENSEN , Robert M. NICKERSON , Nicholas R. WATTS
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/498 ; H01L23/00 ; H01L25/10 ; H05K1/11 ; H05K3/40 ; H01L21/48 ; H01L25/00 ; H01L25/065
Abstract:
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.
Public/Granted literature
- US11978730B2 Offset interposers for large-bottom packages and large-die package-on-package structures Public/Granted day:2024-05-07
Information query
IPC分类:
