Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
-
Application No.: US17668773Application Date: 2022-02-10
-
Publication No.: US20220165750A1Publication Date: 2022-05-26
- Inventor: Sanghoon LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0137329 20191031
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11573 ; H01L27/11565 ; H01L23/522

Abstract:
A semiconductor device including a lower structure, an upper pattern, a stacked structure, a separation structure passing through the stacked structure, a vertical structure comprising a channel layer, wherein the stacked structure comprises a plurality of interlayer insulating layers and a plurality of gate layers, the lower structure comprises a first lower pattern and a second lower pattern of a material different from a material of the first lower pattern, the first lower pattern comprises a first portion between the second lower pattern and the channel layer, a second portion extending from the first portion to a region between the second lower pattern and the upper pattern, and a third portion extending from the first portion to a region between the second lower pattern and the substrate structure, and the first lower pattern does not extend toward a side surface of the upper pattern.
Information query
IPC分类: