The disclosure relates to a vapor chamber for cooling an electronic component. The vapor chamber includes a bottom cover for receiving waste heat from the electronic component, a top cover, wherein the bottom cover and the top cover are formed such that a vapor cavity for accommodating a liquid is formed between the bottom cover and the top cover, a crate element for providing mechanical strength to the vapor chamber, wherein the crate element has at least one compartment, which is formed by at least three side panels being connected to each other and extending from the bottom cover to the top cover, and a top recess facing the top cover and a bottom recess facing the bottom cover, and at least one porous pillar for transferring the liquid from the top cover to the bottom cover.