A camera module according to an embodiment includes base; a guide portion disposed on an inner side of the base; a lens assembly moving along the guide portion; and a substrate disposed on an outer side of the base, wherein the lens assembly includes a conductor disposed under a lower surface thereof, and wherein the substrate includes a resonance coil disposed in a region facing the lower surface of the lens assembly and overlapping at least a part of the conductor in a direction perpendicular to an optical axis direction in response to movement of the lens assembly.