A microelectromechanical system (MEMS) strain gauge pressure sensor includes a top wafer stack having a top surface and a first cavity that is configured to receive a first fluid at a first pressure, a backing wafer having a bottom surface opposite the top surface of the top wafer stack; a diaphragm wafer positioned between the top wafer stack and the backing wafer and having a second cavity that is configured to receive a second fluid at a second pressure, and a pedestal connected laterally to the top wafer stack, the backing wafer, and the diaphragm wafer. The diaphragm wafer includes a diaphragm extending between the first cavity and the second cavity, and a resistor positioned on the diaphragm. The MEMS strain gauge pressure sensor has a central axis such that the MEMS strain gauge pressure sensor has mechanical symmetries about the central axis.