Invention Application
- Patent Title: HIGH STRENGTH AND HIGH THERMAL CONDUCTIVITY POLYETHYLENE THIN FILM HAVING A BIMODAL MOLECULAR WEIGHT
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Application No.: US17554982Application Date: 2021-12-17
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Publication No.: US20220348747A1Publication Date: 2022-11-03
- Inventor: Sheng Ye , Andrew John Ouderkirk , Arman Boromand , Christopher Stipe , Hao Mei , Christopher Yuan Ting Liao
- Applicant: META PLATFORMS TECHNOLOGIES, LLC
- Applicant Address: US CA Menlo Park
- Assignee: META PLATFORMS TECHNOLOGIES, LLC
- Current Assignee: META PLATFORMS TECHNOLOGIES, LLC
- Current Assignee Address: US CA Menlo Park
- Main IPC: C08L23/06
- IPC: C08L23/06 ; C08K5/01 ; C08K3/014

Abstract:
An optically clear, high strength, high modulus, and high thermal conductivity polyethylene thin film may be formed from a crystallizable polymer and an additive configured to interact with the crystallizable polymer to facilitate crystallite alignment and, in some examples, create a higher crystalline content within the polyethylene thin film. The polyethylene thin film may be characterized by a bimodal molecular weight distribution where the molecular weight of the additive may be less than approximately 5% of the molecular weight of the crystallizable polymer. Example crystallizable polymers may include high molecular weight polyethylene, high density polyethylene, and ultra-high molecular weight polyethylene. Example additives may include low molecular weight polyethylene and polyethylene oligomers. The polyethylene thin film may be characterized by a Young's modulus of at least approximately 10 GPa, a tensile strength of at least approximately 0.7 GPa, and a thermal conductivity of at least approximately 5 W/mK.
Public/Granted literature
- US12031019B2 High strength and high thermal conductivity polyethylene thin film having a bimodal molecular weight Public/Granted day:2024-07-09
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