Invention Application
- Patent Title: SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE
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Application No.: US17760906Application Date: 2020-09-16
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Publication No.: US20220349733A1Publication Date: 2022-11-03
- Inventor: Akiko TANAKA , Shigeki ISHIGURO , Yoshiko KIRA , Shintaro FUKUMOTO , Shun IMAGAWA , Takayuki NISHIDO
- Applicant: NITTO DENKO CORPORATION , IHI INSPECTION AND INSTRUMENTATION CO., LTD.
- Applicant Address: JP Ibaraki-shi, Osaka; JP Shinagawa-ku, Tokyo
- Assignee: NITTO DENKO CORPORATION,IHI INSPECTION AND INSTRUMENTATION CO., LTD.
- Current Assignee: NITTO DENKO CORPORATION,IHI INSPECTION AND INSTRUMENTATION CO., LTD.
- Current Assignee Address: JP Ibaraki-shi, Osaka; JP Shinagawa-ku, Tokyo
- Priority: JP2019-168780 20190917
- International Application: PCT/JP2020/035044 WO 20200916
- Main IPC: G01D5/353
- IPC: G01D5/353 ; C09J5/06 ; C09J7/38
Abstract:
The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
Public/Granted literature
- US12158362B2 Sensor package and method for attaching sensor package Public/Granted day:2024-12-03
Information query
IPC分类:
