An array substrate having a light-emitting unit region, a bonding region, and a bending region located between the light-emitting unit region and the bonding region. The light-emitting unit region is configured to be provided with light-emitting units. The bonding region is configured to bond a control circuit. The array substrate includes a base substrate located in the light-emitting unit region and the bonding region, a first organic material layer, a metal intermediate layer, and a second organic material layer. The first organic material layer is disposed on a side of the base substrate. The metal intermediate layer is disposed on a side of the first to organic material layer away from the base substrate. The second organic material layer is disposed on a side of the metal intermediate layer away from the base substrate.