Invention Application
- Patent Title: INDUCTORS IN TRENCHES WITHIN A SUBSTRATE
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Application No.: US17334194Application Date: 2021-05-28
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Publication No.: US20220384560A1Publication Date: 2022-12-01
- Inventor: Telesphor KAMGAING
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01F5/00 ; H01F5/06

Abstract:
Embodiments described herein may be related to apparatuses, processes, and techniques related to inductors located within a substrate. An inductor may be created in a glass core using a laser-assisted etching of glass interconnects techniques to create trenches or vias within the glass substrate, into which conductive material may be plated or filled to create the inductor. In embodiments, the inductors may be low equivalent series resistance (ESR) compact air-core inductors. Other embodiments may be described and/or claimed.
Information query
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