A sensor device having a sensor housing and a printed circuit board coupled to the sensor housing. A light emitting device is coupled to the printed circuit board. The light emitting device has an emitter face defining an emission face area. An aperture plate is coupled to the sensor housing, the aperture plate defines an aperture having an aperture area that is less than the emission face area of the emitter face. The aperture is less than 1 mm from the emitter face wherein the light emitting device is not fixed to the aperture plate. A lens is coupled to the sensor housing, having an optical axis extending through the aperture. The aperture plate is positioned between the lens and the emitter face. Boresighting angle variation across sensor components on a manufacturing line may advantageously be reduced without increased cost associated with active alignment. Irradiance drop-out may also be reduced.