Invention Publication
- Patent Title: Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
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Application No.: US18083412Application Date: 2022-12-16
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Publication No.: US20230143406A1Publication Date: 2023-05-11
- Inventor: Lifang Xu , Indra V. Chary , Justin B. Dorhout , Jian Li , Haitao Liu , Paolo Tessariol
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- The original application number of the division: US16550252 2019.08.25
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H10B41/27 ; H10B41/35 ; H10B43/35

Abstract:
A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Operative channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. The operative channel-material strings in the laterally-spaced memory blocks comprise part of a memory plane. An elevationally-extending wall is in the memory plane laterally-between immediately-laterally-adjacent of the memory blocks and that completely encircles an island that is laterally-between immediately-laterally-adjacent of the memory blocks in the memory plane. Other embodiments, including method are disclosed.
Public/Granted literature
- US11864387B2 Memory arrays and methods used in forming a memory array comprising strings of memory cells Public/Granted day:2024-01-02
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