Invention Publication
- Patent Title: HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT
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Application No.: US18148627Application Date: 2022-12-30
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Publication No.: US20230145761A1Publication Date: 2023-05-11
- Inventor: Yiqi TANG , Liang WAN , William Todd HARRISON , Manu Joseph PRAKUZHY , Rajen Manicon MURUGAN
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H02M3/158 ; H01L23/00

Abstract:
In some examples, a direct current (DC)-DC power converter package comprises a controller, a conductive member, and a first field effect transistor (FET) coupled to the controller and having a first source and a first drain, the first FET coupled to a first portion of the conductive member. The package also comprises a second FET coupled to the controller and having a second source and a second drain, the second FET coupled to a second portion of the conductive member, the first and second portions of the conductive member being non-overlapping in a horizontal plane. The first and second FETs are non-overlapping.
Public/Granted literature
- US11901271B2 High current packages with reduced solder layer count Public/Granted day:2024-02-13
Information query
IPC分类: