Invention Publication
- Patent Title: BUFFER MATERIAL
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Application No.: US18052954Application Date: 2022-11-07
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Publication No.: US20230147271A1Publication Date: 2023-05-11
- Inventor: Jun TAKIZAWA , Tetsuji FUJITA , Tomoaki NAKAMURA , Hisashi KOIKE
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 21181858 2021.11.08
- Main IPC: B31F1/22
- IPC: B31F1/22 ; B31D1/00

Abstract:
A buffer material of the present disclosure is a buffer material including a buffer sheet that contains cellulose fibers and a binding material binding the cellulose fibers and has a sheet shape, in which the buffer sheet has a plurality of first projections that protrude toward at least one surface side and are provided in a lattice shape. Further, it is preferable that the buffer sheet further have a plurality of second projections having a projection amount that is greater than a projection amount of the first projections.
Information query