Invention Publication
- Patent Title: SPHERICAL SILICA POWDER
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Application No.: US17920631Application Date: 2021-04-22
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Publication No.: US20230147757A1Publication Date: 2023-05-11
- Inventor: Takuto OKABE , Motoharu FUKAZAWA , Toru ARAI
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP 20077291 2020.04.24 JP 20164696 2020.09.30
- International Application: PCT/JP2021/016377 2021.04.22
- Date entered country: 2022-10-21
- Main IPC: C01B33/18
- IPC: C01B33/18 ; C08K3/36

Abstract:
A spherical silica powder which, when heated from 25° C. up to 1000° C. at a rate of 30° C./min, desorbs water molecules in an amount of 0.01 mmol/g or less at 500° C. to 1000° C., and which has a specific surface area of 1 to 30 m2/g.
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