An electrical insulation mixture for forming a layer on a conductor surface is provided. The mixture includes an UV curable thermoset resin and a filler. The filler includes UV transparent platelets made of a platelet material. UV transparency is given for light in a wavelength range between 300 and 420 nm. Furthermore, a method for electrically insulating a metallic conductor is provided. The method includes obtaining the electrical insulation mixture, forming a jacketing on a surface of the metallic conductor using the mixture thus obtained, and exposing the mixture to ultraviolet radiation to cure the mixture, thus forming, from the jacketing, an electrical insulation layer on the surface of the metallic conductor. A metallic conductor with an electrical insulation layer can be obtained by using the electrical insulation mixture.