Invention Publication
- Patent Title: VERTICAL ACCESS LINE IN A FOLDED DIGITLINE SENSE AMPLIFIER
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Application No.: US17540589Application Date: 2021-12-02
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Publication No.: US20230180467A1Publication Date: 2023-06-08
- Inventor: Anton P. Eppich
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L27/108
- IPC: H01L27/108 ; G11C11/4091 ; G11C5/06

Abstract:
The present disclosure includes apparatuses and methods for vertical access line in a folded digitline sense amplifier. An example apparatus includes an array of memory cells. The memory cells form active areas having adjacent access devices, each access device having a first source/drain region and a second source/drain region separated by a channel region and a gate opposing the channel region. A pair of adjacent memory cells can share a digitline contact at the second source/drain region. A storage node contact can be coupled to respective first source/drain regions and each gate can be connected to vertically oriented access lines formed on opposing side of a depletion region to each access device. An insulator material can be patterned between adjacent digitlines to isolate adjacent memory cells.
Public/Granted literature
- US12114489B2 Vertical access line in a folded digitline sense amplifier Public/Granted day:2024-10-08
Information query
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