Invention Publication
- Patent Title: Seamlessly Integrated Microcontroller Chip
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Application No.: US17943183Application Date: 2022-09-12
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Publication No.: US20230185744A1Publication Date: 2023-06-15
- Inventor: Scott David Kee
- Applicant: AyDeeKay LLC dba Indie Semiconductor
- Applicant Address: US CA Aliso Viejo
- Assignee: AyDeeKay LLC dba Indie Semiconductor
- Current Assignee: AyDeeKay LLC dba Indie Semiconductor
- Current Assignee Address: US CA Aliso Viejo
- Main IPC: G06F13/26
- IPC: G06F13/26 ; G06F13/40 ; G06F3/06 ; G06F12/06 ; G06F12/0866 ; G06F13/16 ; G06F13/28 ; G06F13/364 ; G06F13/42 ; G06F13/14 ; G06F21/76

Abstract:
Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
Public/Granted literature
- US12026112B2 Seamlessly integrated microcontroller chip Public/Granted day:2024-07-02
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