Invention Publication
- Patent Title: SECURE ENCLAVE SYSTEM-IN-PACKAGE
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Application No.: US17926438Application Date: 2021-05-21
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Publication No.: US20230185748A1Publication Date: 2023-06-15
- Inventor: Peter Robert LINDER , Masood MURTUZA , Erik James WELSH , William Arthur Fitzhugh LEE
- Applicant: Octavo Systems LLC
- Applicant Address: US TX Sugar Land
- Assignee: Octavo Systems LLC
- Current Assignee: Octavo Systems LLC
- Current Assignee Address: US TX Sugar Land
- International Application: PCT/US2021/033667 2021.05.21
- Date entered country: 2022-11-18
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F15/78

Abstract:
A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.
Public/Granted literature
- US12001363B2 Secure enclave system-in-package Public/Granted day:2024-06-04
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