Invention Publication
- Patent Title: SEMICONDUCTOR MEMORY DEVICE
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Application No.: US17896241Application Date: 2022-08-26
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Publication No.: US20230187352A1Publication Date: 2023-06-15
- Inventor: Inho ROH , Donghwa KWAK , Kyung Don MUN , Wonsok LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210176536 2021.12.10
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L27/108 ; H01L23/522

Abstract:
A semiconductor memory device includes a substrate including active regions, the active regions having first impurity regions and second impurity regions, word lines on a first surface of the substrate, the word lines extending in a first direction, first bit lines on the word lines, the first bit lines extending in a second direction crossing the first direction, and the first bit lines being connected to the first impurity regions, first contact plugs between the first bit lines, the first contact plugs being connected to the second impurity regions, respectively, second bit lines on a second surface of the substrate, the second bit lines being electrically connected to the first impurity regions, and a first capacitor on the first contact plugs.
Information query
IPC分类: