Invention Publication
- Patent Title: FLUIDIC CAVITIES FOR ON-CHIP LAYERING AND SEALING OF SEPARATION ARRAYS
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Application No.: US18165434Application Date: 2023-02-07
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Publication No.: US20230191398A1Publication Date: 2023-06-22
- Inventor: Evan Colgan , Joshua T. Smith , Benjamin Wunsch
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- The original application number of the division: US16274532 2019.02.13
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B81C1/00 ; B81B7/00 ; G01N15/02
Abstract:
A method for fabricating a fluidic device includes depositing a sacrificial material on a pillar array arranged on a substrate. The method also includes removing a portion of the sacrificial material. The method further includes depositing a sealing layer on the pillar array to form a sealed fluidic cavity.
Public/Granted literature
- US11992837B2 Fluidic cavities for on-chip layering and sealing of separation arrays Public/Granted day:2024-05-28
Information query
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