Invention Publication
- Patent Title: METHOD FOR PREDICTING DELAY AT MULTIPLE CORNERS FOR DIGITAL INTEGRATED CIRCUIT
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Application No.: US18010131Application Date: 2022-03-09
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Publication No.: US20230195986A1Publication Date: 2023-06-22
- Inventor: Peng CAO , Kai WANG , Tai YANG , Wei BAO
- Applicant: SOUTHEAST UNIVERSITY
- Applicant Address: CN Nanjing
- Assignee: SOUTHEAST UNIVERSITY
- Current Assignee: SOUTHEAST UNIVERSITY
- Current Assignee Address: CN Nanjing
- Priority: CN 2110582508.7 2021.05.26
- International Application: PCT/CN2022/079922 2022.03.09
- Date entered country: 2022-12-13
- Main IPC: G06F30/367
- IPC: G06F30/367 ; G06N3/0442 ; G06N3/045 ; G06N3/0464

Abstract:
Disclosed in the present invention is a method for predicting a delay at multiple corners for a digital integrated circuit, which is applicable to the problem of timing signoff at multiple corners. In the aspect of feature engineering, a path delay relationship at adjacent corners is extracted by using a dilated convolutional neural network (Dilated CNN), and learning is performed by using a bi-directional long short-term memory model (Bi-directional Long Short-Term Memory, BLSTM) to obtain topology information of a path. Finally, prediction results of a path delay at a plurality of corners are obtained by using an output of a multi-gate mixture-of-experts network model (Multi-gate Mixture-of-Experts, MMoE). Compared with a conventional machine learning method, the present invention can achieve prediction with higher precision through more effective feature engineering processing in a case of low simulation overheads, and is of great significance for timing signoff at multiple corners of a digital integrated circuit.
Public/Granted literature
- US11755807B2 Method for predicting delay at multiple corners for digital integrated circuit Public/Granted day:2023-09-12
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