Invention Publication
- Patent Title: Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid
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Application No.: US17557529Application Date: 2021-12-21
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Publication No.: US20230197552A1Publication Date: 2023-06-22
- Inventor: Kamal K. Sikka , Katsuyuki Sakuma , Hilton T. Toy , Shidong Li , Ravi K. Bonam
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/053 ; H01L23/31 ; H01L25/065 ; H01L23/46 ; H01L23/00 ; H01L25/00
Abstract:
An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.
Public/Granted literature
- US11887908B2 Electronic package structure with offset stacked chips and top and bottom side cooling lid Public/Granted day:2024-01-30
Information query
IPC分类:
