Invention Publication
- Patent Title: PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
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Application No.: US18175284Application Date: 2023-02-27
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Publication No.: US20230197690A1Publication Date: 2023-06-22
- Inventor: Tongbi Jiang , Yong Poo Chia
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- The original application number of the division: US14802941 2015.07.17
- Main IPC: H01L25/07
- IPC: H01L25/07 ; H01L25/00 ; H01L23/31 ; H01L23/48 ; H01L21/768 ; H01L21/82 ; H01L23/00 ; H01L21/56 ; H01L23/538 ; H01L25/10
Abstract:
A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
Public/Granted literature
- US12087738B2 Packaged integrated circuit devices with through-body conductive vias, and methods of making same Public/Granted day:2024-09-10
Information query
IPC分类:
