Invention Publication
- Patent Title: FLUID INTERCONNECTION FOR BULK INK SUPPLY
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Application No.: US18308989Application Date: 2023-04-28
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Publication No.: US20230256747A1Publication Date: 2023-08-17
- Inventor: Steven R. Komplin
- Applicant: FUNAI ELECTRIC CO., LTD.
- Applicant Address: JP Osaka
- Assignee: FUNAI ELECTRIC CO., LTD.
- Current Assignee: FUNAI ELECTRIC CO., LTD.
- Current Assignee Address: JP Osaka
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
A fluid interconnect system including a mating component having an inlet port and a liquid outlet, the inlet port configured to support an interconnector and the liquid outlet configured to engage with a print cartridge so that liquid flows from a liquid source, through the interconnector and the inlet port, and out of the liquid outlet into the print cartridge.
Public/Granted literature
- US11958296B2 Fluid interconnection for bulk ink supply Public/Granted day:2024-04-16
Information query
IPC分类: