Invention Publication
- Patent Title: THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME
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Application No.: US18012834Application Date: 2020-12-24
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Publication No.: US20230260698A1Publication Date: 2023-08-17
- Inventor: Daiki ISHII , Yoshihiko YANO , Yuki YAMASHITA , Kenichi YOSHIDA , Tetsuhiro TAKAHASHI
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- International Application: PCT/JP2020/048397 2020.12.24
- Date entered country: 2022-12-23
- Main IPC: H01G4/01
- IPC: H01G4/01 ; H01L25/16 ; H01G4/33

Abstract:
To provide a thin film capacitor having high flexibility. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The particle diameter of crystal at a non-roughened center part of the metal foil is less than 15 μm in the planar direction and less than 5 μm in the thickness direction. This can not only enhance the flexibility of the metal foil to reduce a short-circuit failure in a state where the thin film capacitor is incorporated in a multilayer substrate but also enhance positional accuracy.
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