An integrated circuit includes an interposer and a die coupled to the interposer. The die includes a first data processing engine (DPE) array and a second DPE array. The first DPE array includes a first plurality of DPEs and a first DPE interface coupled to the first plurality of DPEs. The second DPE array includes a second plurality of DPEs and a second DPE interface coupled to the second plurality of DPEs. The integrated circuit includes one or more other dies having a first die interface coupled to, and configured to communicate with, the first DPE interface via the interposer and a second die interface coupled to, and configured to communicate with, the second DPE interface via the interposer.