Invention Publication
- Patent Title: SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER
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Application No.: US18450143Application Date: 2023-08-15
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Publication No.: US20230402396A1Publication Date: 2023-12-14
- Inventor: Bok Gyu MIN , Suk Won LEE
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si Gyeonggi-do
- Priority: KR 20200094286 2020.07.29
- The original application number of the division: US17148436 2021.01.13
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L25/065
Abstract:
A semiconductor package may include a first die disposed on a package substrate, a second die stacked on the first die, and a first position checker disposed on the package substrate. The first position checker may indicate a first position allowable range in which a first side of the first die can be located.
Public/Granted literature
- US12033952B2 Semiconductor packages including at least one die position checker Public/Granted day:2024-07-09
Information query
IPC分类:
