Invention Application
- Patent Title: HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
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Application No.: US18075433Application Date: 2022-12-06
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Publication No.: US20230100904A1Publication Date: 2023-03-30
- Inventor: Po-Wen Su , Ming-Hua Chang , Shui-Yen Lu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: CN202010081655.1 20200206
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/205 ; H01L29/06 ; H01L29/66 ; H01L29/20

Abstract:
A high electron mobility transistor (HEMT) includes a buffer layer on a substrate, ridges extending along a first direction on the buffer layer, gaps extending along the first direction between the ridges, a p-type semiconductor layer extending along a second direction on the ridges and inserted into the gaps, and a source electrode and a drain electrode adjacent to two sides of the p-type semiconductor layer. Preferably, the source electrode and the drain electrode are extending along the second direction and directly on top of the ridges.
Public/Granted literature
- US12040393B2 High electron mobility transistor and method for fabricating the same Public/Granted day:2024-07-16
Information query
IPC分类: