Invention Application
- Patent Title: TWO-DIMENSIONAL MATERIAL STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE TWO-DIMENSIONAL MATERIAL STRUCTURE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
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Application No.: US17690376Application Date: 2022-03-09
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Publication No.: US20230112883A1Publication Date: 2023-04-13
- Inventor: Minsu SEOL , Keunwook SHIN , Junyoung KWON , Minseok YOO , Changseok LEE
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0134444 20211008
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/16 ; H01L29/24 ; H01L29/786 ; H01L21/02 ; H01L29/66

Abstract:
Provided are a two-dimensional material structure, a semiconductor device including the two-dimensional material structure, and a method of manufacturing the semiconductor device. The two-dimensional material structure may include a first insulator including a first dielectric material; a second insulator on the first insulator and including a second dielectric material; a first two-dimensional material film on an exposed surface of the first insulator; and a second two-dimensional material film provided on an exposed surface of the second insulator. The first and second two-dimensional material films may include a two-dimensional material having a two-dimensional layered structure, and the second two-dimensional material film may include more layers of the two-dimensional material than the first two-dimensional material film.
Information query
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