Invention Application
- Patent Title: CIRCUIT APPARATUS, MANUFACTURING METHOD THEREOF AND CIRCUIT SYSTEM
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Application No.: US17585588Application Date: 2022-01-27
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Publication No.: US20230138696A1Publication Date: 2023-05-04
- Inventor: Hung-Hsien Ko , Yi-Cheng Lu , Heng-Yin Chen , Hao-Wei Yu , Te-Hsun Lin
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW110140235 20211029
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/16 ; H05K1/03

Abstract:
Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.
Public/Granted literature
- US11963295B2 Circuit apparatus, manufacturing method thereof and circuit system Public/Granted day:2024-04-16
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