Invention Publication
- Patent Title: APPARATUS FOR DIRECT CONTACT HEAT PIPE
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Application No.: US17812193Application Date: 2022-07-13
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Publication No.: US20240023280A1Publication Date: 2024-01-18
- Inventor: CHIN-CHUNG WU , CHUN-HAN LIN , CHE-JUNG CHANG , YUEH CHING LU
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.
Public/Granted literature
- US11991859B2 Apparatus for direct contact heat pipe Public/Granted day:2024-05-21
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