Systems and methods are provided for cleaning surfaces of a workpiece. The system includes a housing defining an enclosure, a holding structure within the enclosure that is configured to support a workpiece, a first powder removal device that is configured to propel a first media toward the holding structure such that the first media contacts the workpiece while the workpiece is supported by the holding structure, a first sensing device that is configured to detect surface characteristics of the workpiece while the workpiece is supported by the holding structure, and a controller configured to, by a processor: detect a powder material on a surface of the workpiece based on the surface characteristics, and selectively operate the first powder removal device to remove the powder material from the surface with the first media while the workpiece is supported by the holding structure.