Invention Publication
- Patent Title: OPTIMIZATION OF LITHOGRAPHIC PROCESS BASED ON BANDWIDTH AND SPECKLE
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Application No.: US18266246Application Date: 2021-12-09
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Publication No.: US20240045341A1Publication Date: 2024-02-08
- Inventor: Willard Earl CONLEY , Duan-Fu Stephen HSU , Joshua Jon THORNES , Johannes Jacobus Matheus BASELMANS
- Applicant: ASML NETHERLANDS B.V. , Cymer, LLC
- Applicant Address: NL CA Veldhoven
- Assignee: ASML NETHERLANDS B.V.,Cymer, LLC
- Current Assignee: ASML NETHERLANDS B.V.,Cymer, LLC
- Current Assignee Address: NL Veldhoven; US CA San Diego
- International Application: PCT/EP2021/084967 2021.12.09
- Date entered country: 2023-06-08
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/20

Abstract:
A method for improving a lithographic process of imaging a portion of a design layout onto a substrate using a lithographic apparatus. The method includes computing a multi-variable cost function that is a function of: (i) a plurality of design variables that affect characteristics of the lithographic process and (ii) a radiation bandwidth of a radiation source of the lithographic apparatus; and reconfiguring one or more of the characteristics (e.g., EPE, image contrast, resist, etc.) of the lithographic process by adjusting one or more of the design variables (e.g., source, mask layout, bandwidth, etc.) until a termination condition is satisfied. The termination condition includes a speckle characteristic (e.g., a speckle contrast) maintained within a speckle specification associated with the radiation source and also maintaining an image contrast associated with the lithographic process within a desired range. The speckle characteristic being a function of the radiation bandwidth.
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