Invention Publication
- Patent Title: SILICONE ADHESIVE COMPOSITION AND USE THEREOF
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Application No.: US18268225Application Date: 2021-12-14
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Publication No.: US20240059932A1Publication Date: 2024-02-22
- Inventor: Satoshi ONODERA , Harumi NIKI , Tomohiro IIMURA
- Applicant: DOW TORAY CO., LTD.
- Applicant Address: JP Shinagawa-Ku, Tokyo
- Assignee: DOW TORAY CO., LTD.
- Current Assignee: DOW TORAY CO., LTD.
- Current Assignee Address: JP Shinagawa-Ku, Tokyo
- Priority: JP 20216896 2020.12.25
- International Application: PCT/JP2021/046138 2021.12.14
- Date entered country: 2023-06-17
- Main IPC: C09J7/38
- IPC: C09J7/38 ; C09J7/20

Abstract:
Provided is a composition with a viscosity in which coating is possible even with a small amount of solvent, has excellent curability, and in which an Si-based pressure-sensitive adhesive (PSA) (e.g., PSA layer) formed by a curing reaction has a low (e.g., 50° C. or lower) glass transition temperature (Tg) despite having high PSA strength and tack, has favorable wettability, and has favorable mechanical strength and elongation; and an application of the same. A low/solvent-free silicone PSA composition comprises: (A) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group only on a molecular chain end, (B) a straight-chain organohydrogenpolysiloxane having Si—H only on both ends, (C) an organopolysiloxane resin with a weight average molecular weight that is less than 5000, (D) an organopolysiloxane having one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than an end and three or more in a molecule, and (E) a hydrosilylation-reaction catalyst.
Information query
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