Invention Publication
- Patent Title: ELECTRONIC PACKAGE
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Application No.: US18503025Application Date: 2023-11-06
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Publication No.: US20240072214A1Publication Date: 2024-02-29
- Inventor: Olivier ZANELLATO , Remi BRECHIGNAC , Jerome LOPEZ
- Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
- Current Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
- Current Assignee Address: FR Grenoble
- Priority: FR 09984 2020.09.30
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L31/0203 ; H01L31/18 ; H01L33/00
Abstract:
The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.
Public/Granted literature
- US12218287B2 Electronic package Public/Granted day:2025-02-04
Information query
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