Invention Publication
- Patent Title: RESIN COMPOSITION AND RESIN MOLDED ARTICLE
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Application No.: US18272887Application Date: 2022-01-25
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Publication No.: US20240084098A1Publication Date: 2024-03-14
- Inventor: Takuya MASUDA , Yuusuke SUENAGA , Ryuuji MATSUMURA , Isao HIGUCHI , Takamichi SHINOHARA
- Applicant: SEKISUI TECHNO MOLDING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SEKISUI TECHNO MOLDING CO., LTD.
- Current Assignee: SEKISUI TECHNO MOLDING CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP 21009386 2021.01.25 JP 21009387 2021.01.25 JP 21104364 2021.06.23
- International Application: PCT/JP2022/002550 2022.01.25
- Date entered country: 2023-07-18
- Main IPC: C08K3/04
- IPC: C08K3/04 ; C08J5/04 ; C08K7/00

Abstract:
Provided is a resin composition with which a resin molded article having excellent heat dissipation can be obtained. A resin composition containing: a thermoplastic resin; graphite; and a fibrous body, when the resin composition in a molten state is filled in a mold from a direction orthogonal to a thickness direction of a resulting resin molded article 1 and molded to obtain a resin molded article 1 of 100 mm in length×100 mm in width×2 mm in thickness, in a cross-section obtained by cutting the resin molded article 1 along a direction X parallel to a filling direction and a thickness direction Z, among regions 1A to 1E obtained by dividing the cross-section into five equal parts in the thickness direction Z, an average orientation angle (A) with respect to a plane direction of the graphite in at least one of the regions 1A and 1E on outermost layer sides being 15° or less, and an average orientation angle (B) with respect to the plane direction of the graphite in the central region 1C being 35° or more.
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