Invention Publication
- Patent Title: MANUFACTURING METHOD OF CAPACITOR STRUCTURE
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Application No.: US18509268Application Date: 2023-11-14
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Publication No.: US20240088209A1Publication Date: 2024-03-14
- Inventor: Chia-Wei Wu , Yu-Cheng Tung
- Applicant: Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: CN Quanzhou City
- Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: CN Quanzhou City
- Priority: CN 2111266442.7 2021.10.28 CN 2122616148.6 2021.10.28
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H10B12/00

Abstract:
A capacitor structure and a manufacturing method thereof are disclosed in this invention. The capacitor structure includes a first electrode, a second electrode, and a capacitor dielectric stacked layer. The capacitor dielectric stacked layer is disposed between the first electrode and the second electrode, and the capacitor dielectric stacked layer includes a first dielectric layer. The first dielectric layer includes a first zirconium oxide layer and a first zirconium silicon oxide layer. A manufacturing method of a capacitor structure includes the following steps. A capacitor dielectric stacked layer is formed on a first electrode, and the capacitor dielectric stacked layer includes a first dielectric layer. The first dielectric layer includes a first zirconium oxide layer and a first zirconium silicon oxide layer. Subsequently, a second electrode is formed on the capacitor dielectric stacked layer, and the capacitor dielectric stacked layer is located between the first electrode and the second electrode.
Public/Granted literature
- US12062689B2 Manufacturing method of capacitor structure Public/Granted day:2024-08-13
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