Invention Publication
- Patent Title: CONFORMAL TRANSFER DOPING METHOD FOR FIN-LIKE FIELD EFFECT TRANSISTOR
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Application No.: US18524417Application Date: 2023-11-30
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Publication No.: US20240097010A1Publication Date: 2024-03-21
- Inventor: Sai-Hooi Yeong , Sheng-Chen Wang , Bo-Yu Lai , Ziwei Fang , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- The original application number of the division: US16396961 2019.04.29
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/225 ; H01L21/265 ; H01L29/165

Abstract:
Doping techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes forming a fin structure, forming a doped amorphous layer over a portion of the fin structure, and performing a knock-on implantation process to drive a dopant from the doped amorphous layer into the portion of the fin structure, thereby forming a doped feature. The doped amorphous layer includes a non-crystalline form of a material. In some implementations, the knock-on implantation process crystallizes at least a portion of the doped amorphous layer, such that the portion of the doped amorphous layer becomes a part of the fin structure. In some implementations, the doped amorphous layer includes amorphous silicon, and the knock-on implantation process crystallizes a portion of the doped amorphous silicon layer.
Public/Granted literature
- US12249640B2 Conformal transfer doping method for Fin-like field effect transistor Public/Granted day:2025-03-11
Information query
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