Invention Publication
- Patent Title: MICROCHIPS FOR USE IN ELECTRON MICROSCOPES AND RELATED METHODS
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Application No.: US18479994Application Date: 2023-10-03
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Publication No.: US20240120172A1Publication Date: 2024-04-11
- Inventor: Vinayak P. Dravid , Xiaobing Hu , Kunmo Koo
- Applicant: Northwestern University
- Applicant Address: US IL Evanston
- Assignee: Northwestern University
- Current Assignee: Northwestern University
- Current Assignee Address: US IL Evanston
- Main IPC: H01J37/244
- IPC: H01J37/244 ; B81C1/00 ; H01J37/26

Abstract:
Method for fabricating a microchip are provided which may comprise forming a dopant mask layer on a front side surface of a silicon substrate having the front side surface and an opposing back side surface; removing a portion of the dopant mask layer according to a pattern to form a first exposed silicon region in the silicon substrate and a first unexposed silicon region in the silicon substrate; doping the first exposed silicon region in the silicon substrate with a p-type dopant to form a first p-type doped silicon region in the silicon substrate; forming a silicon nitride layer on the front side surface of the silicon substrate comprising the first p-type doped silicon region and the first unexposed silicon region; and forming an opening in the silicon substrate from the opposing back side surface of the silicon substrate to provide a microchip comprising the silicon substrate having the opening, a first silicon nitride window positioned within the opening, and a support structure mounted to the first silicon nitride window, the support structure comprising the first p-type doped silicon region. The fabricated microchips and methods of using the microchips are also provided.
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