Apparatuses, systems, and methods for a controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. An apparatus includes at least two compression interfaces, each for compressing a mounting assembly of a thermal management device to a predetermined loading point. The apparatus further includes a frame configured to apply a preload force to the at least two compression interfaces. The frame has a pivoting joint at an assembly point for each of the at least two compression interfaces to balance the preload force between the at least two compression interfaces.