A semiconductor package includes a first redistribution wiring layer having first redistribution wirings, a first semiconductor chip on the first redistribution wiring layer and having a first thickness from the first redistribution wiring layer, a second semiconductor chip disposed on the first redistribution wiring layer spaced apart from the first semiconductor chip and having a second thickness from the first redistribution wiring layer smaller than the first thickness, a sealing member covering the first semiconductor chip and the second semiconductor chip on the first redistribution wiring layer, a plurality of conductive vias provided in the sealing member and electrically connected to the first redistribution wirings, a second redistribution wiring layer disposed on the sealing member and having second redistribution wirings electrically connected to the conductive vias, and at least one third semiconductor chip disposed on the second redistribution wiring layer and electrically connected to the second redistribution wirings.