Invention Publication
- Patent Title: WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PLATE, WIRING BODY INTERMEDIATE MATERIAL, AND METHOD FOR MANUFACTURING WIRING BODY
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Application No.: US18548450Application Date: 2022-03-16
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Publication No.: US20240145374A1Publication Date: 2024-05-02
- Inventor: Takayoshi NIRENGI , Akihiro OISHI , Tsutomu AISAKA , Daisuke MATSUSHITA , Jumpei IWANAGA , Tadashi TOJO
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP 21047463 2021.03.22
- International Application: PCT/JP2022/011952 2022.03.16
- Date entered country: 2023-08-30
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48
Abstract:
A wiring body disposed above a substrate including a conductor includes: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. The via electrode includes: a seed layer formed along an inner surface of the insulating layer from above the conductor in the via hole; a via electrode body layer formed to be located above the seed layer and fill the via hole; and an adhesion layer formed between the seed layer and the inner surface of the insulating layer in the via hole.
Information query
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