Invention Publication
- Patent Title: OPEN EARPHONES
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Application No.: US18355407Application Date: 2023-07-19
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Publication No.: US20240147109A1Publication Date: 2024-05-02
- Inventor: Lei ZHANG , Peigeng TONG , Guolin XIE , Yongjian LI , Jiang XU , Tao ZHAO , Duoduo WU , Ao JI , Xin QI
- Applicant: SHENZHEN SHOKZ CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN SHOKZ CO., LTD.
- Current Assignee: SHENZHEN SHOKZ CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN 2211336918.4 2022.10.28 CN 2223239628.6 2022.12.01 WO TCN2022144339 2022.12.30
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/02 ; H04R1/28

Abstract:
The present disclosure provides an open earphone, including: a sound production component including: a transducer including a diaphragm configured to generate a sound; and a housing forming a cavity used to accommodate the transducer, wherein in a wearing state, the housing is provided with a sound guiding hole on an inner side surface toward an auricle of a user for guiding a sound generated by a front side of the diaphragm out of the housing and into an ear canal, and at least two pressure relief holes are provided on one or more other side surfaces of the housing, the at least two pressure relief holes including a first pressure relief hole away from the ear canal and a second pressure relief hole near the ear canal, and a sound pressure at the first pressure relief hole being greater than a sound pressure at the second pressure relief hole.
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