A precursor composition which can produce a polyimide film with excellent light transmittance, mechanical properties, coefficient of linear thermal expansion and resistance to thermal decomposition; and a polyimide film obtained from the precursor composition. The polyimide precursor composition contains a polyimide precursor with a repeating unit represented by formula (I); an imidazole compound in an amount more than 0.01 mol and 2 mol or less based on one mol of the repeating units of the polyimide precursor, and a solvent.




In general formula I, 70 mol. % or more of X1 is a structure represented by formula (1-1):




and 70 mol % or more of Y1 is a structure represented by formula (D-1) and/or (D-2):