A device includes a first die and a second die. The first die and the second die are stacked and form a monolithic die. A first side of the first die faces a first side of the second die. The second die comprises an electrical connection within its periphery and on a side other than the first side of the second die. The electrical connection exposes the second die to an environment outside of the monolithic die. The electrical connection is configured to facilitate electrical connection between the second die of the monolithic die and an electronic component that is external to the monolithic die.