Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK
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Application No.: US18434028Application Date: 2024-02-06
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Publication No.: US20240222458A1Publication Date: 2024-07-04
- Inventor: Jia-Chuan YOU , Huan-Chieh SU , Kuo-Cheng CHIANG , Chih-Hao WANG
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/8234 ; H01L27/088 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device structure includes a first channel structure and a second channel structure over a substrate. The semiconductor device structure also includes a first gate stack over the first channel structure and a second gate stack over the second channel structure. The first gate stack and the second gate stack have a first work function layer and a second work function layer, respectively. The first work function layer and the second work function layer are made of a same material. The second gate stack has a first protruding portion and a second protruding portion, and each of the first protruding portion and the second protruding portion extends upwards and extend away from the second channel structure. The first protruding portion and the second protruding portion are spaced apart from each other, and half of the first gate stack is wider than the first protruding portion.
Public/Granted literature
- US12324215B2 Semiconductor device structure with metal gate stack Public/Granted day:2025-06-03
Information query
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