Invention Application
- Patent Title: DIRECT METAL DEPOSITION OF ELECTRONIC DEVICE COMPONENTS
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Application No.: US18784470Application Date: 2024-07-25
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Publication No.: US20240375181A1Publication Date: 2024-11-14
- Inventor: Anthony D. Prescenzi , Abhijeet Misra , Adam T. Clavelle , Eric W. Hamann , Isabel Yang , Brian M. Gable , James A. Yurko
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: B22F10/25
- IPC: B22F10/25 ; B22F10/66 ; B32B15/01 ; B33Y10/00 ; B33Y40/20 ; B33Y80/00
Abstract:
A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.
Information query
