Invention Application
- Patent Title: TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS
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Application No.: US18669662Application Date: 2024-05-21
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Publication No.: US20240395587A1Publication Date: 2024-11-28
- Inventor: Kenichi TAKEMASA , Kazuyuki YAMADA , Keisuke ASADA , Daiki ISONO
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Priority: JP2023-087200 20230526
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L23/00 ; H01L25/075
Abstract:
Performance of an electronic component including a plurality of elements is improved. A transfer substrate includes: a support substrate; an adhesive resin layer continuously provided on one surface of the support substrate and having a plurality of holding regions adhesively holding elements; and a coating film provided on a surface of the adhesive resin layer opposite to the support substrate to cover an outer region of the holding region of the adhesive resin layer and having lower surface adhesiveness than surface adhesiveness of the adhesive resin layer.
Public/Granted literature
- US3139046A Vault door construction Public/Granted day:1964-06-30
Information query
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