A terminal portion provided in a frame region around a display region is provided with a resin substrate, an inorganic layered film provided above the resin substrate, a pad column provided above the inorganic layered film, the pad column including a plurality of pads arranged in a row electrically connected to a plurality of bumps provided on an IC chip via an ACF, and a flattening film including an organic insulating film provided above the inorganic layered film and the pad column, the flattening film covering an end portion of each of the plurality of pad, and an opening exposing the inorganic layered film is formed in the flattening film.